Fremont, CA (March 30, 2026) – Aehr Test Systems (NASDAQ: AEHR), a prominent provider of test and burn-in solutions for semiconductor devices utilised in various sectors including artificial intelligence (AI), data centres, automotive, and industrial applications, has announced the forthcoming release of its financial results for the third quarter of fiscal 2026, which concluded on February 27, 2026. The announcement is set for Tuesday, April 7, 2026, following the close of market operations.
Conference Call and Webcast Details
Aehr Test Systems will host a conference call and webcast to discuss these results at 5:00 p.m. Eastern Time (2:00 p.m. PT). Interested parties can participate using the following details:
- Dial-in Number: For the live call, please dial +1 888-506-0062 (US and Canada) or +1 973-528-0011 (International) and provide the participant passcode 767066.
- Webcast: Access the live webcast via the investor relations section at www.aehr.com.
- Call Replay: A phone replay will be available approximately two hours after the live call and will remain accessible for one week. To hear the replay, dial +1 877-481-4010 (US and Canada) or +1 919-882-2331 (International) and enter the replay passcode 53776.
Aehr Test Systems Overview
Headquartered in Fremont, California, Aehr Test Systems stands as a leader in providing comprehensive test solutions for the testing, burning-in, and stabilisation of semiconductor devices in various forms, including wafer level, singulated die, and packaged parts. The company has established a robust presence globally, with thousands of systems installed.
The increasing demands for quality, reliability, safety, and security in semiconductors, particularly in applications such as electric vehicles, renewable energy sources like solar and wind power, and advanced computing, continue to create new opportunities for Aehr’s products and solutions.
Aehr has pioneered several innovative products, including the FOX-PTM families of test and burn-in systems, as well as the FOX WaferPak™ Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier, and FOX DiePak Loader. The FOX-XP and FOX-NP systems are designed for full-wafer contact and singulated die/module test and burn-in, capable of testing a diverse range of devices, including cutting-edge silicon carbide-based power semiconductors, 2D and 3D sensors for mobile technology, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices.
Additionally, the FOX-CP system offers a cost-effective solution for testing logic, memory, and photonic devices, complementing the FOX-P product family. The FOX WaferPak Contactor features a unique full-wafer contactor that can accommodate wafers up to 300mm, enabling IC manufacturers to perform testing, burn-in, and stabilisation of full wafers efficiently.
Furthermore, the FOX DiePak Carrier facilitates the testing, burning-in, and stabilisation of singulated bare die and modules, allowing for parallel processing of up to 1024 devices per DiePak across the FOX-NP and FOX-XP systems, with the ability to manage nine DiePaks simultaneously.
Following its acquisition of Incal Technology, Inc., Aehr has expanded its offerings to include high-power packaged part reliability and burn-in test solutions tailored for AI semiconductor manufacturers. This includes the ultra-high-power Sonoma family of test solutions designed for AI accelerators, GPUs, and high-performance computing (HPC) processors, positioning Aehr as a turnkey provider of reliability and testing solutions within the rapidly expanding AI market.
For further information, please visit the Aehr Test Systems website at www.aehr.com.