TeraHop to Present Innovative Optical Connectivity Solutions for AI Data Centres at OFC 2026

At the upcoming OFC 2026, TeraHop is set to showcase groundbreaking advancements in optical connectivity, particularly tailored for the evolving needs of AI data centres. The highlights of their presentation will include the industry’s first high-capacity and high-density 12.8Tbps XPO optical modules, along with the 6.4Tbps pluggable NPO modules. These innovations are expected to significantly enhance the scalability of AI optical applications, drawing on TeraHop’s foundational expertise in silicon photonics.

Live Demonstrations at OFC

During the conference, TeraHop will conduct live demonstrations featuring:

The industry’s first 12.8T-8xDR8 XPO optical transceiver module, which delivers superior capacity to support next-generation AI scalability.
The 6.4T-4xDR8 Pluggable NPO module, noted for its high density and low power consumption, specifically designed for AI scaling.
The pioneering 4x400G Optical transceiver module, aimed at demonstrating the practicality of next-generation 400G per lane optics for 3.2T applications.
The innovative 1.6T-2x LR4 OSFP and 800G-LR2 coherent lite optical transceivers, facilitating scalability across multiple AI data centre buildings.
A collaborative demonstration of the 1.6T-DR8 OSFP optical transceivers in partnership with Nvidia DSP.
64×64 and 300×300 MEMS-based optical circuit switch (OCS) systems, designed to enable lower power consumption in data centre networking and reconfigurable AI compute fabrics.
PCIe 6 AOC and AEC technologies.

Collaborative Demonstrations with Industry Partners

In addition to individual product demonstrations, TeraHop will engage in collaborative live demonstrations with various industry partners and standards bodies, including:

The industry’s first Multi-core fiber (MCF) native 1.6T-2xDR4 OSFP optical transceiver in a joint live demo with Corning at booth #1739.
MCF-native 800G-2xDR4 OSFP, 1.6T-2xDR4 FRO, RTLR, and LPO optical transceivers at the OIF interoperability demonstration at booth #2017.

Participation in OFC Forums and Workshops

TeraHop representatives will also take part in several key forums and workshops during OFC, including:

Optica Executive Forum on March 16 at 10:50 am, focusing on “Scale Out Data Center Networks.”
Data Center Summit on March 17 at 2:15 pm, addressing the “Challenges in Scale Up and Scale Out for Future Growth.”

About TeraHop

TeraHop is a global leader in high-speed optical connectivity solutions, specifically designed for AI and data centre networking applications. With its headquarters in Singapore, TeraHop operates on a global scale with a presence in the United States, Thailand, Taiwan, and Suzhou, China. To learn more about their innovative solutions, please visit www.terahop.com.